Identify the reason for using K[Ag(CN)2] instead of AgNO3 in the silver plating of copper.
A thin layer of Ag is formed on Cu
Ag+ions are completely removed from solution
There is less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]−ion
More voltage is required
A
A thin layer of Ag is formed on Cu
B
More voltage is required
C
Ag+ions are completely removed from solution
D
There is less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]−ion
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Solution
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Copper being more electropositive readily precipitate silver from their salt solution.
Cu+2AgNO3→Cu(NO3)2+Ag
In K[Ag(CN)2] solution a complex anion [Ag(CN)2] is formed so Ag+ ions are less available in the solution and Cu cannot displace Ag from this complex ion.
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