Identify the reason using Kleft - Agleft - CN right -2- right - instead of AgNO-3- in the silver plating of copper-A thin layer of Ag is formed on CuAg-ions are completely removed from solutionThere is availability of Ag- ions- as Cu cannot displace Ag from left -Agleft-CNright-2- right-ionMore voltage is required

Question

Toppr Admin · Accepted Answer

Copper being more electropositive readily precipitate silver from their salt solution.

$C u + 2 A g N O_{3} \to {C u (N O_{3})}_{2} + A g$

In $K [A g (C N)_{2}]$ solution a complex anion $[A g (C N)_{2}]$ is formed so $A g^{+}$ ions are less available in the solution and $C u$ cannot displace $A g$ from this complex ion.

Identify the reason for using K[Ag(CN)2] instead of AgNO3 in the silver plating of copper.A thin layer of Ag is formed on CuAg+ions are completely removed from solutionThere is less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]−ionMore voltage is required

Copper being more electropositive readily precipitate silver from their salt solution. Cu+2AgNO3→Cu(NO3)2+AgIn K[Ag(CN)2] solution a complex anion [Ag(CN)2] is formed so Ag+ ions are less available in the solution and Cu cannot displace Ag from this complex ion.